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Rote Lumineszenzdiode Red Emitter Lead (Pb) Free Product - RoHS Compliant SFH 4272
Wesentliche Merkmale * Schwarz eingefarbtes TOPLED-Gehause * Typische Emissionswellenlange 645nm * Verbesserte Abbildungseigenschaften durch Absorption der Seitenstrahlung * Groe der Leuchtquelle 200m x 200m * Feuchte-Empfindlichkeitsstufe 2 nach JEDEC Standard J-STD-020C Anwendungen * Miniaturlichtschranken und Lichtschranken uber groe Entfernungen * Industrieelektronik * Messen/Steuern/Regeln" * Automobiltechnik * Sensorik * Alarm- und Sicherungssysteme
Features * Black coloured TOPLED-package * Typical Peakwavelength 645nm * Improved imaging characteristics due to absorption of side emission * Size of emitting area 200m x 200m * Moisture sensitivity level 2 according to JEDEC Standard J-STD-020C Applications * * * * * * Miniature and long distance photointerrupters Industrial electronics For drive and control circuits Automotive technology Sensor technology Alarm and safety equipment
Typ Type SFH 4272
1)
Bestellnummer Ordering Code Q65110A2522
Strahlstarkegruppierung1) (IF = 20 mA, tp = 20 ms) Radiant Intensity Grouping1) Ie (mW/sr) > 0.16 (typ. 0.35)
gemessen bei einem Raumwinkel = 0.01 sr / measured at a solid angle of = 0.01 sr
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1
SFH 4272
Grenzwerte (TA = 25 C) Maximum Ratings Bezeichnung Parameter Betriebs- und Lagertemperatur Operating and storage temperature range Sperrspannung Reverse voltage Durchlassstrom Forward current Stostrom, = 10 s, D = 0 Surge current Verlustleistung Power dissipation Symbol Symbol Wert Value - 40 ... + 100 5 30 1 80 500 Einheit Unit C V mA A mW K/W
Top; Tstg VR IF IFSM Ptot
Warmewiderstand Sperrschicht - Umgebung bei RthJA Montage auf FR4 Platine, Padgroe je 16 mm2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 16 mm2 each Warmewiderstand Sperrschicht - Lotstelle bei RthJS Montage auf Metall-Block Thermal resistance junction - soldering point, mounted on metal block
280
K/W
2007-06-18
2
SFH 4272
Kennwerte (TA = 25 C) Characteristics Bezeichnung Parameter Wellenlange der Strahlung Wavelength at peak emission IF = 20 mA, tp = 20 ms Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 20 mA Abstrahlwinkel Half angle Aktive Chipflache Active chip area Abmessungen der aktiven Chipflache Dimensions of the active chip area Durchlassspannung Forward voltage IF = 20 mA, tp = 20 ms Sperrstrom Reverse current VR = 5 V Gesamtstrahlungsfluss Total radiant flux IF = 20 mA, tp = 20 ms Temperaturkoeffizient von Ie bzw. e, IF = 20 mA Temperature coefficient of Ie or e, IF = 20 mA Temperaturkoeffizient von VF, IF = 20 mA Temperature coefficient of VF, IF = 20 mA Temperaturkoeffizient von , IF = 20 mA Temperature coefficient of , IF = 20 mA Symbol Symbol peak Wert Value 645 Einheit Unit nm
16
nm
60 0.04 0.2 x 0.2 2.0 ( 2.5)
Grad deg. mm2 mm V
A LxB LxW VF
IR
0.01 ( 10)
A
e
1
mW
TCI
- 0.5
%/K
TCV TC
-2 + 0.14
mV/K nm/K
Strahlstarke Ie in Achsrichtung (gemessen bei einem Raumwinkel = 0.01 sr) Radiant Intensity Ie in Axial Direction (at a solid angle of = 0.01 sr) Bezeichnung Parameter Strahlstarke Radiant intensity IF = 20 mA, tp = 20 ms
2007-06-18
Symbol Ie
Werte Values > 0.16 (typ. 0.35)
Einheit Unit mW/sr
3
SFH 4272
Relative Spectral Emission Irel = f ()
100 % 80 super-red
10 0
OHL01487
Radiant Intensity
Ie/Ie(20 mA) = f (IF)
10 1
OHL02348
Max. Permissible Forward Current IF = f (TA)
35
OHL01013
Irel
IV I V (20 mA)
I F mA
30
TA
25 20 15
10
-1
TS
60
40
10
20
5
0 550
10 -2 10 0
TA temp. ambient TS temp. solder point
0 20 40 60 80 C 100
600
650
nm 700
10 1
mA
10 2
0
IF
T
Forward Current IF = f (VF) single pulse, tp = 20 s
10 2 mA 5
OHL00232
Permissible Pulse Handling Capability IF = f (tp), TA = 25 C duty cycle D = parameter
10 0 A 5
OHL00318
IF
IF
10
1
D=
0.005 0.01 0.02 0.05 0.1 0.2 0.5
5
10 -1
10 0 5
5
D = TP
10 -1 1 1.4 1.8 2.2 2.6 3 V 3.4
t
tP
IF T
10 -2 -5 10 10 -4 10 -3 10 -2 10 -1 10 0 10 1 s 10 2
VF
tp
Radiation Characteristics Irel = f ()
40 30 20 10 0
OHL01660
1.0
50
0.8
0.6 60 0.4 70 0.2 80 90 100 1.0 0.8 0.6 0.4 0 20 40 60 80 100 120 0
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4
SFH 4272
Mazeichnung Package Outlines
3.0 (0.118) 2.6 (0.102) 2.3 (0.091) 2.1 (0.083)
2.1 (0.083) 1.7 (0.067) 0.1 (0.004) (typ.) 0.9 (0.035) 0.7 (0.028)
3.7 (0.146) 3.3 (0.130) 41
A
(2.4) (0.095)
3.4 (0.134) 3.0 (0.118)
C
1.1 (0.043) 0.5 (0.020)
Cathode marking
0.18 (0.007) 0.12 (0.005)
0.6 (0.024) 0.4 (0.016)
GPLY6724
Mae in mm (inch) / Dimensions in mm (inch).
Gehause / Package Anschlussbelegung Pin configuration Farbe Color Brechungsindex Verguss Refractive index resin
TOPLED(R), klarer Verguss / TOPLED(R), clear resin abgeschragte Ecke: Kathode beveled edge: Cathode schwarz black 1.53 1.53
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5
SFH 4272
Empfohlenes Lotpaddesign Recommended Solder Pad Reflow Loten Reflow Soldering
2.6 (0.102)
1.5 (0.059)
4.5 (0.177)
2.6 (0.102)
Padgeometrie fur verbesserte Warmeableitung Paddesign for improved heat dissipation Lotstopplack Solder resist Cu-Flache > 16 mm 2 Cu-area > 16 mm 2
OHLPY970
Mae in mm (inch) / Dimensions in mm (inch).
2007-06-18
6
1.5 (0.059)
4.5 (0.177)
SFH 4272
Lotbedingungen Soldering Conditions Reflow Lotprofil fur bleifreies Loten Reflow Soldering Profile for lead free soldering
300 C 255 C 240 C 217 C 200 30 s max 150 120 s max 100 Ramp Up 3 K/s (max) 25 C 0 0 50 100 150 200 250 s 300 100 s max Ramp Down 6 K/s (max) 10 s min
Vorbehandlung nach JEDEC Level 2 Preconditioning acc. to JEDEC Level 2 (nach J-STD-020C) (acc. to J-STD-020C)
OHLA0687
T 250
Maximum Solder Profile Recommended Solder Profile Minimum Solder Profile
C 260 C +0C -5 245 C 5 C C 235 C +5C -0
50
t
Wellenloten (TTW) TTW Soldering
300 C T 250 235 C ... 260 C 2. Welle 2. wave 200 1. Welle 1. wave 150 100 C ... 130 C 100 2 K/s 50 Zwangskuhlung forced cooling ca 200 K/s 5 K/s 2 K/s
(nach CECC 00802) (acc. to CECC 00802)
OHLY0598
10 s
Normalkurve standard curve Grenzkurven limit curves
0 0 50 100 150 t 200 s 250
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SFH 4272
Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com (c) All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2007-06-18 8

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